Core Functions

1. Data Storage FunctionIt has a storage capacity of 4GB, which can be used for storing various types of data.

2. Communication Protocol CompatibilityCompliant with the e.MMC 5.1 specification and backward compatible with previous e.MMC standards, it supports multiple data bus widths, including 1-bit, 4-bit and 8-bit in SDR mode; 4-bit and 8-bit in DDR mode; 4-bit and 8-bit in HS200 mode; as well as 8-bit in HS400 mode.

3. High Clock FrequencyIt features a maximum clock frequency of up to 200MHz — with the upper limit at 52MHz for both SDR and DDR modes, and 200MHz for both HS200 and HS400 modes — enabling high-speed data transmission.

4. Additional FunctionsIt supports boot functions/boot partitions, partition management, RPMB (Replay Protected Memory Block), HPI (High Priority Interrupt), BKOPS (Background Operations) and other features. It also comes with hardware/software reset, health monitoring, and field firmware update capabilities.

Main Application Fields

1. Consumer ElectronicsSuitable for wearable devices such as smart watches, as well as smartphones, tablet computers, set-top boxes and game consoles. Its high integration and stable storage performance can meet the data storage and high-speed read/write requirements of these devices.

2. Industrial SectorApplicable to scenarios like industrial automation control, data acquisition and sensor networks. Its wide operating temperature range (-40°C to +85°C) and reliable storage capability make it adaptable to the harsh requirements of industrial environments.

Technical Advantages

1. High PerformanceSupporting high-speed modes including HS400 and HS200, it can achieve a high data transmission rate via an 8-bit data bus in HS400 mode, satisfying application scenarios with demanding requirements for data read/write speeds.

2. Low Power ConsumptionWith optimized power management functions, it has an operating voltage range of 1.7V–1.95V or 2.7V–3.6V, and consumes low power in different modes, making it suitable for power-sensitive devices.

3. High ReliabilityEquipped with a built-in flash memory controller and advanced firmware algorithms, it features wear leveling, defect management, garbage collection and ECC (Error Checking and Correction) functions, which can effectively extend the chip’s service life and improve the reliability of data storage.

4. Small-Size PackageAdopting a 153-ball VFBGA package with dimensions of 9.0 mm × 7.5 mm × 0.8 mm, its compact size facilitates integration into electronic devices with limited space.